EP4CGX15BF14C6N vs EP4CGX15BF14I7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX15BF14C6N sa pamamagitan ng Intel at EP4CGX15BF14I7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CGX15BF14C6N | EP4CGX15BF14I7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 14,400 | — |
| Embedded Memory | 552,960 bits (540 Kbits) | — |
| Embedded 18x18 Multipliers | 56 | — |
| General-Purpose I/O | 72 | — |
| Maximum User I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Transceivers | Up to 3.125 Gbps | Up to 4 channels, 3.125 Gbps |
| Core Voltage | 1.2 V | — |
| Speed Grade | C6 (commercial) | I7 (industrial) |
| Temperature na Operasyon | 0C to +85C (commercial) | -40C to +100C (junction); meets C8 timing up to +125C |
| Packhaging | 169-LBGA (FBGA) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Level ng MSL | 3 (168 hours) | — |
| Tindminan RoHS | Compliant | Compliant |
| Process Node | 60 nm | — |
| Configuration Schemes | AS, JTAG | — |
| Logic Elements (LE) | — | 14,400 |
| Logic Array Blocks (LABs) / CLBs | — | 900 |
| Total Embedded Memory Bits | — | 552,960 |
| Maximum User I/O Pins | — | 72 |
| PLLs | — | 2 |
| Embedded Multipliers (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| Supply Voltage - Core | — | 1.2 V |
| Package Type | — | 169-LBGA (FBGA-169) |
| Package Dimensions | — | 14 x 14 mm |
| Ball Pitch | — | 1.0 mm |
| POR Time (Standard) | — | 50 ms to 200 ms |
| POR Time (Fast) | — | 3 ms to 9 ms |