EP4CGX22BF14I7N vs EP4CGX15BF14I7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX22BF14I7N sa pamamagitan ng Intel at EP4CGX15BF14I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP4CGX22BF14I7N - 22K LE Cyclone IV GX FPGA, 169-LBGA | Intel (Altera)
EP4CGX22BF14I7N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP4CGX22BF14I7N | EP4CGX15BF14I7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV GX | Cyclone IV GX |
| Device | EP4CGX22 | — |
| Logic Elements (LE) | 21,280 | — |
| Logic Blocks | 47 (per digchip datasheet summary) | — |
| Embedded Memory Bits | 774,144 (594 Kbits) | 552,960 |
| Maximum User I/O Pins | 72 | — |
| Multipliers (18×18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| PLLs | 4 (general-purpose) | — |
| Transceivers | 2 (up to 3.125 Gbps) | — |
| Core Voltage | 1.2 V | — |
| Temperature na Operasyon | -40 °C to +100 °C (industrial, 'I7N' speed/temp grade) | -40C to +100C (industrial, I7 grade) |
| Packhaging | 169-LBGA (FineLine BGA, F14, 14×14 mm, 1.0 mm pitch) | 169-ball LBGA (14x14 mm) |
| Process Technology | 60 nm | 60 nm low-power CMOS |
| Configuration | SRAM, serial (AS) and parallel (AP) modes, JTAG | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | Compliant (per distributor listings) | Compliant |
| Logic Elements (LEs) | — | 14,400 |
| Embedded 18x18 Multipliers | — | 56 |
| User I/O Pins | — | 72 |
| Number of PLLs | — | 2 |
| Transceiver Channels | — | 8 (up to 3.125 Gbps) |
| Volte ng Pagbibigay | — | 1.2 V core |
| Level ng MSL | — | 3 |
| Lead-Free | — | Yes |