EP4CGX22BF14I7N vs EP4CGX22BF14C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX22BF14I7N sa pamamagitan ng Intel at EP4CGX22BF14C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP4CGX22BF14I7N - 22K LE Cyclone IV GX FPGA, 169-LBGA | Intel (Altera)
EP4CGX22BF14I7N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP4CGX22BF14I7N | EP4CGX22BF14C8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV GX | Cyclone IV GX |
| Device | EP4CGX22 | — |
| Logic Elements (LE) | 21,280 | — |
| Logic Blocks | 47 (per digchip datasheet summary) | — |
| Embedded Memory Bits | 774,144 (594 Kbits) | — |
| Maximum User I/O Pins | 72 | — |
| Multipliers (18×18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| PLLs | 4 (general-purpose) | — |
| Transceivers | 2 (up to 3.125 Gbps) | — |
| Core Voltage | 1.2 V | — |
| Temperature na Operasyon | -40 °C to +100 °C (industrial, 'I7N' speed/temp grade) | 0C to +85C |
| Packhaging | 169-LBGA (FineLine BGA, F14, 14×14 mm, 1.0 mm pitch) | 169-ball LBGA (FBGA-169, F14, 14x14 mm) |
| Process Technology | 60 nm | — |
| Configuration | SRAM, serial (AS) and parallel (AP) modes, JTAG | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant (per distributor listings) | Compliant |
| Device Logic Elements | — | 21,280 |
| Logic Array Blocks (LABs) | — | 1330 |
| Embedded Memory | — | 774144 bit (594 Kbit M9K) |
| Embedded 18x18 Multipliers | — | 72 |
| User I/O Pins (Maximum) | — | 83 |
| Transceiver Count | — | 2 (3.125 Gbps) |
| Process Node | — | 60 nm |
| Core Supply Voltage | — | 1.2 V |
| PLL Count | — | 2 |
| Speed Grade | — | C8 (commercial, 8) |
| Level ng MSL | — | 3 (168 hours) |
| Configuration Interface | — | JTAG / AS / PS |