EP4CGX30CF19C7 vs EP4CGX30CF19I6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX30CF19C7 sa pamamagitan ng Intel at EP4CGX30CF19I6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP4CGX30CF19C7 - Cyclone IV GX FPGA, 29K Logic Elements, 324-FBGA | Intel
EP4CGX30CF19C7 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP4CGX30CF19C7 | EP4CGX30CF19I6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV GX | Cyclone IV GX |
| Series | EP4CGX30 | — |
| Device Model | EP4CGX30CF19C7 | — |
| Logic Elements | 29,440 | — |
| Configurable Logic Blocks (CLBs) | 1,840 | — |
| Embedded Memory Bits | 1,105,920 bits | — |
| Embedded 18x18 Multipliers | 66 | 66 |
| User I/O Pins (maximum) | 150 | — |
| Transceiver Channels | 4 | — |
| Transceiver Data Rate | up to 3.125 Gbps | — |
| Temperature na Operasyon | 0 C to +85 C (Commercial) | -40C to +100C (industrial) |
| Internal Performance | approximately 472 MHz | — |
| Packhaging | 324-ball FBGA (F19), 19 x 19 mm, 1.0 mm pitch | FBGA-324 (Plastic, 19 mm x 19 mm) |
| Volte ng Pagbibigay | 1.2 V core, 2.5 V/3.3 V I/O | — |
| Uri ng Pagpapasok | Surface Mount (SMT) | — |
| Tindminan RoHS | Compliant | Compliant |
| Process Technology | 60 nm low-k CMOS | 60 nm |
| Logic Elements (LE) | — | 29,440 |
| Embedded Memory | — | 108 Kb (M9K blocks) |
| Number of Memory Blocks | — | 4 |
| PLLs | — | 4 |
| Transceivers | — | Up to 8 channels, 3.125 Gbps |
| Maximum User I/O | — | 364 |
| Core Supply Voltage | — | 1.2 V nominal (1.16 V to 1.24 V) |
| Temperature Grade Suffix | — | I6N (industrial, lead-free) |
| Package Code | — | F19 |
| Lead-Free | — | Yes |
| Design Tool | — | Quartus Prime |