EP4CGX50DF27I8N vs EP4CGX50DF27I6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX50DF27I8N sa pamamagitan ng Intel at EP4CGX50DF27I6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP4CGX50DF27I8N - Cyclone IV GX FPGA, 49,888 LEs, 672-FBGA | Intel
EP4CGX50DF27I8N ✓ NakahandaIntel
EP4CGX50DF27I6N - Cyclone IV GX FPGA, 49.9K LEs, 672-FBGA | Intel (Altera)
EP4CGX50DF27I6N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP4CGX50DF27I8N | EP4CGX50DF27I6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LEs) | 49,888 | — |
| Embedded Memory (bits) | 2,562,048 | — |
| Embedded Memory Blocks | 250 x M9K | — |
| 18 x 18 Multipliers | 200 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Maximum User I/O Pins | 310 | — |
| Transceiver Channels | 8 (up to 3.125 Gbps) | 8 |
| PCI Express Hard IP | Gen1 x1/x2/x4 | — |
| Process Technology | 60 nm | 60 nm low-power |
| Core Supply Voltage | 1.2 V | — |
| I/O Bank Voltages | 1.0 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Packhaging | 672-ball FineLine BGA (F27) | 672-ball FBGA (F27) |
| Speed Grade | 8 (fastest) | — |
| Temperature Grade | Industrial (-40 C to +100 C) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements | — | 49,888 |
| Core Voltage | — | 1.2 V |
| Embedded Memory | — | 2,502 Kbits |
| Embedded Multipliers (18x18) | — | 113 |
| Maximum User I/O | — | 310 |
| Transceiver Data Rate | — | up to 3.125 Gbps |
| General-purpose PLLs | — | 4 |
| Operating Temperature (Industrial grade) | — | -40C to +100C junction |
| Configuration Modes | — | AS, PS, FPP, JTAG |