EP4CGX75CF23C7N vs EP4CGX75CF23C7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX75CF23C7N sa pamamagitan ng Intel at EP4CGX75CF23C7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP4CGX75CF23C7 - Cyclone IV GX FPGA 73.9k LE, 290 I/O, 484-BGA | Intel
EP4CGX75CF23C7 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP4CGX75CF23C7N | EP4CGX75CF23C7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone IV GX | — |
| Logic Elements | 73,920 | — |
| Embedded Memory (bits) | 4,257,792 | — |
| Maximum User I/O Pins | 290 | — |
| Number of Logic Array Blocks (LABs) | 4,500 | — |
| Total Transceiver Channels | 8 (up to 3.125 Gbps) | — |
| Number of PLLs | 4 | — |
| Hard Memory Controllers | 2 | — |
| Core Supply Voltage | 1.16 V to 1.24 V (nominal 1.2 V) | — |
| Temperature na Operasyon | 0 °C to 85 °C (commercial) | 0C to +85C (commercial, C7 suffix) |
| Packhaging | 484-ball BGA (F23, 23 x 23 mm) | 484-BGA (FBGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Process Technology | 60 nm low-power CMOS | — |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| Tindminan RoHS | Compliant | Non-Compliant (Contains Lead per DigChip listing) |
| Family | — | Cyclone IV GX |
| Logic Elements (LE) | — | 73,920 |
| Number of Logic Gates | — | [DATA_NEEDED: gates] |
| Total Memory Bits | — | 4,257,792 bits |
| Embedded Memory | — | M9K blocks |
| Number of I/O | — | 290 |
| Number of LABs/CLBs | — | 4620 |
| Package Code | — | F23 |
| Ball Pitch | — | 1.0 mm |
| Supply Voltage (Core) | — | 1.0V / 1.2V |
| Transceivers | — | 3.125 Gbps integrated |
| Lead Free Status | — | Contains Lead (per DigChip listing) |