EP4SGX290NF45I4N vs EP4SGX360KF40I4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX290NF45I4N sa pamamagitan ng Intel at EP4SGX360KF40I4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4SGX290NF45I4N | EP4SGX360KF40I4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 291,200 | 353600 |
| LABs/CLBs | 11,648 | 14144 |
| Total RAM Bits | 17,661,952 | — |
| User I/O Count | 920 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Core Voltage | 0.87 V to 0.93 V | 0.9 V |
| Process Technology | 40 nm | 40 nm |
| Transceivers | 8.5 Gbps multi-gigabit (GX) | [DATA_NEEDED: number of embedded transceivers and max data rate] |
| Packhaging | 1932-BBGA, FCBGA (NF45) | 1517-BBGA, FCBGA (Flip-Chip BGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature ng Junction na Operasyon | -40C to +100C (industrial) | — |
| Tindminan RoHS | Compliant | Compliant |
| JESD-609 Code | e1 | — |
| Package Body Material | Plastic / Epoxy | — |
| Terminal Form | Ball | — |
| Package Code | BGA | — |
| Adaptive Logic Modules (ALMs) | — | 141440 |
| Number of I/O | — | 744 |
| Embedded Memory Bits | — | 23105536 |
| Package Pin/Ball Count | — | 1517 |
| Operating Temperature Grade | — | Industrial (I4 suffix) |
| Lead Free | — | Yes |
| Level ng MSL | — | [DATA_NEEDED: MSL moisture sensitivity level] |
| DSP Blocks | — | [DATA_NEEDED: number of DSP blocks and 18x18 multiplier count] |