EP4SGX360FF35C4 vs EP4SGX290NF45I4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX360FF35C4 sa pamamagitan ng Intel at EP4SGX290NF45I4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4SGX360FF35C4 | EP4SGX290NF45I4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Aktibo |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 353600 | 291,200 |
| Number of LABs/CLBs | 14144 | — |
| Total RAM Bits | 23105536 | 17,661,952 |
| Number of I/O | 564 | — |
| Number of Transceivers | 8 | — |
| Core Voltage | 0.9 V | 0.87 V to 0.93 V |
| Process Technology | 40 nm | 40 nm |
| Packhaging | 1152-BBGA, FCBGA (flip-chip) | 1932-BBGA, FCBGA (NF45) |
| Temperature na Operasyon | 0C to +85C (commercial) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Level ng MSL | 3 (per JEDEC J-STD-020) | — |
| Tindminan RoHS | [DATA_NEEDED: rohs status] | Compliant |
| Lead-Free | Yes (per BGA finish) | — |
| Supplier Device Package | 1152-FBGA | — |
| LABs/CLBs | — | 11,648 |
| User I/O Count | — | 920 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Transceivers | — | 8.5 Gbps multi-gigabit (GX) |
| Temperature ng Junction na Operasyon | — | -40C to +100C (industrial) |
| JESD-609 Code | — | e1 |
| Package Body Material | — | Plastic / Epoxy |
| Terminal Form | — | Ball |
| Package Code | — | BGA |