EP4SGX360FF35C4 vs EP4SGX360FF35C2XN Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX360FF35C4 sa pamamagitan ng Intel at EP4SGX360FF35C2XN sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP4SGX360FF35C2XN - Stratix IV GX FPGA 353K LE 1152-FCBGA | Intel
EP4SGX360FF35C2XN ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP4SGX360FF35C4 | EP4SGX360FF35C2XN |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Aktibo |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 353600 | 353,600 |
| Number of LABs/CLBs | 14144 | — |
| Total RAM Bits | 23105536 | 23,105,536 |
| Number of I/O | 564 | 564 |
| Number of Transceivers | 8 | 24 |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm | 40 nm TSMC |
| Packhaging | 1152-BBGA, FCBGA (flip-chip) | 1152-BBGA, FCBGA (Flip-Chip BGA) |
| Temperature na Operasyon | 0C to +85C (commercial) | 0C to +85C (Commercial) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Level ng MSL | 3 (per JEDEC J-STD-020) | — |
| Tindminan RoHS | [DATA_NEEDED: rohs status] | Compliant |
| Lead-Free | Yes (per BGA finish) | Yes |
| Supplier Device Package | 1152-FBGA | — |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| LABs/CLBs | — | 14,144 |
| Embedded Memory (bits) | — | 23,105,536 |
| Number of Logic Elements/Cells | — | 353,600 |
| User I/O Banks | — | 12 |
| Supply Voltage - Core | — | 0.9 V |
| Speed Grade | — | -2 |
| Transceiver Data Rate (max) | — | 8.5 Gbps |
| DSP Multipliers (18x18) | — | 1,920 (estimated per family datasheet) |