EP4SGX360FH29C4 vs EP4SGX360FH29C2X Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX360FH29C4 sa pamamagitan ng Intel at EP4SGX360FH29C2X sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP4SGX360FH29C2X - 353600 LEs Stratix IV GX FPGA, 780-HBGA | Intel
EP4SGX360FH29C2X ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP4SGX360FH29C4 | EP4SGX360FH29C2X |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV | — |
| Logic Elements | 353,600 | 353600 |
| Adaptive Logic Modules (ALMs) | 141,440 | — |
| Logic Array Blocks (LABs) | 14,144 | — |
| Embedded Memory (bits) | 23,105,536 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| User I/Os | 289 | — |
| Transceivers | [DATA_NEEDED: number of transceivers and max data rate] | — |
| Core Voltage | 0.9 V | — |
| Process Node | 40 nm | — |
| Temperature na Operasyon | 0 C to +85 C (commercial, C4 grade) | — |
| Packhaging | 780-ball FC-HFBGA (HBGA-780), 33 x 33 mm | 780-BBGA, FCBGA (33x33 mm) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free / Halogen-Free | [DATA_NEEDED: lead-free and halogen-free status] | — |
| Level ng MSL | [DATA_NEEDED: MSL rating] | 3 |
| Configuration Method | JTAG / Fast Passive Parallel / Active Serial | — |
| LABs/CLBs | — | 14144 |
| Total RAM Bits | — | 23105536 |
| Number of I/O | — | 289 |
| Number of Transceivers | — | 24 |
| Transceiver Data Rate | — | Up to 8.5 Gbps |
| Core Voltage Supply | — | 0.87 V to 0.93 V |
| Process Technology | — | 40 nm |
| Operating Temperature Grade | — | Commercial |
| Speed Grade | — | C2 |