EP4SGX360HF35C3N vs EP4SGX360HF35C2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX360HF35C3N sa pamamagitan ng Altera at EP4SGX360HF35C2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP4SGX360HF35C2 - Stratix IV GX FPGA, 353K LEs, 35x35mm FCBGA | Intel
EP4SGX360HF35C2 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP4SGX360HF35C3N | EP4SGX360HF35C2 |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Stratix IV GX | Stratix IV GX FPGA |
| Logic Elements (LE) | 353,600 | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| LABs / CLBs | 14,144 | — |
| User I/Os | 564 | — |
| Total Embedded Memory | 23,105,536 bits | — |
| DSP Blocks (9-bit × 9-bit multipliers) | [DATA_NEEDED: DSP block count] | — |
| Transceivers | 8 channels up to 8.5 Gbps | Multi-gigabit serial transceivers (PCIe Gen2/XAUI/CEI-6G capable) |
| Packhaging | 1152-ball FCBGA (HF35), 35 mm × 35 mm | — |
| Core Voltage | 0.9 V | 0.9 V |
| Process Technology | 40 nm | 40 nm |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature grade] | 0C to +85C (commercial) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Tray Standard Quantity | [DATA_NEEDED: tray qty] | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Series | — | Stratix IV GX |
| Logic Elements (LEs) | — | 353,600 |
| LABs/CLBs | — | 14,144 |
| Number of I/O | — | 564 (max 532 user I/O) |
| Embedded Memory (bits) | — | 23,105,536 |
| Number of Logic Cells | — | 353,600 |
| Package Type | — | 1152-pin FC-FBGA |
| Package Code | — | HF35 (35x35 mm, 1.0 mm pitch) |
| Configuration | — | JTAG / Active Serial (external config device) |
| Design Tool | — | Quartus II / Quartus Prime |