EP4SGX70DF29C4N vs EP4SGX70DF29I4G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX70DF29C4N sa pamamagitan ng Intel at EP4SGX70DF29I4G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4SGX70DF29C4N | EP4SGX70DF29I4G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Stratix IV GX | — |
| Family | Stratix IV | Stratix IV GX |
| Logic Elements | 72,600 | 72,600 |
| Adaptive Logic Modules (ALMs) | 2,904 | — |
| Logic Array Blocks (CLBs) | 2,904 | — |
| Maximum User I/O | 372 | — |
| Total Embedded Memory | 4,134 Kbit (5,648,880 bit) | — |
| Number of Logic Cells | 72,600 | — |
| DSP Blocks | 462 | — |
| DSP Multiplier Modes | 9x9, 12x12, 18x18, 36x36 bit | — |
| DSP Block Max Frequency | 600 MHz | — |
| Transceivers | 8 channels (GX) | Up to 8 multi-gigabit channels (per family) |
| Max Transceiver Data Rate | 3.125 Gbps | — |
| Process Node | 40 nm | — |
| Core Voltage | 0.9 V | 0.9 V |
| Speed Grade | C4 | I4 |
| Packhaging | 780-ball FC-FBGA (29 x 29 mm) | 780-BBGA, FCBGA (29x29 mm) |
| Temperature na Operasyon | 0C to +85C (commercial) | -40C to +100C (Industrial) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Lead Free | Yes | — |
| Tindminan RoHS | Compliant | Compliant |
| Configuration Modes | JTAG, AS, PS, FPP | — |
| Configuration Security | Built-in AES encryption and CRC | — |
| Number of LABs/CLBs | — | 2,904 |
| Total RAM Bits | — | 7,564,880 |
| Number of I/O | — | 372 |
| Process Technology | — | 40 nm |
| DSP Multipliers (18x18) | — | 384 (per family) |
| User I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Lead-Free | — | Yes |