EPF10K100AFC484-2N vs EPF10K100EBC356-1X Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K100AFC484-2N sa pamamagitan ng Altera at EPF10K100EBC356-1X sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPF10K100AFC484-2N | EPF10K100EBC356-1X |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Series | FLEX 10KA | FLEX 10KE |
| Family | FLEX 10KA (FLEX-10KA) | — |
| Logic Cells / Elements | 4992 | — |
| Equivalent Gate Count | 100000 | — |
| Number of Logic Array Blocks (LABs) | 624 | — |
| Number of Embedded Array Blocks (EABs) | 12 | — |
| Total RAM Bits | 24576 (from 12 EABs) | 49,152 |
| User I/O Pins | 369 | — |
| Packhaging | 484-FBGA (23 x 23 mm, 1.0 mm pitch) | — |
| Supply Voltage (VCCINT/VCCIO) | 3.0 V to 3.6 V | — |
| Process Technology | 0.30 µm CMOS | — |
| Speed Grade | -2 (mid performance) | -1X |
| Propagation Delay | 0.6 ns | 0.6 ns |
| Temperature na Operasyon | 0 °C to +70 °C (Commercial) | 0 C to +70 C (Commercial) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Internal Memory Type | EAB (RAM/ROM block) | — |
| JTAG Support | IEEE 1149.1 boundary scan | — |
| PCI Compliance | PCI 33 MHz compliant I/O available | — |
| Lead Free / RoHS | Refer to distributor data - FLEX 10KA generation often non-RoHS | — |
| Programming Toolchain | MAX+PLUS II / Quartus legacy support | — |
| Logic Elements | — | 4,992 |
| Typical Gates | — | 100,000 |
| Logic Array Blocks (LABs) | — | 624 |
| Embedded Array Blocks (EABs) | — | 12 |
| User I/O Count | — | 274 |
| Logic Family | — | CMOS |
| Core Process Technology | — | 0.22 um CMOS, 5 metal layers |
| Core Supply Voltage | — | 2.5 V (2.375 V to 2.625 V) |
| I/O Supply Voltage | — | 3.3 V (multi-volt tolerant to 5 V) |
| Package Type | — | 356-LBGA (BGA-356) |
| Package Dimensions | — | 35 x 35 mm, 1.27 mm ball pitch |
| Configuration Method | — | Serial EPROM / Parallel EPROM / JTAG (IEEE 1149.1) |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS status] |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |