EPF10K100EFI256-2 vs EPF10K100EFC256-3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K100EFI256-2 sa pamamagitan ng Intel at EPF10K100EFC256-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K100EFI256-2 - FLEX 10KE FPGA 100K Gates 250MHz 256FBGA | Intel
EPF10K100EFI256-2 ObsoletePagsanggunian na paghahambing
| Parametro | EPF10K100EFI256-2 | EPF10K100EFC256-3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | FLEX 10KE | FLEX 10KE |
| Typical Gates | 100,000 | — |
| Logic Elements / Cells | 4,992 | — |
| Total RAM Bits | 49,152 | — |
| Logic Array Blocks (LABs) | 624 | 624 |
| Embedded Array Blocks (EABs) | 12 | — |
| User I/O Pins | 191 | — |
| Packhaging | 256-Ball FineLine BGA (FBGA-256) | 256-ball FBGA (FineLine BGA) |
| Package Body Size | 17 x 17 mm | — |
| Ball Pitch | 1.0 mm | — |
| Supply Voltage - Core | 2.5 V | — |
| Supply Voltage - I/O | 3.3 V | — |
| Maximum Toggle Frequency | 250 MHz | — |
| Propagation Delay | 0.5 ns (typical) | 0.6 ns |
| Process Technology | 0.22 µm CMOS, 4-layer metal | 0.22 micron CMOS |
| Temperature na Operasyon | 0C to +70C (commercial) | 0C to +70C (commercial) |
| Configuration Mode | Passive Serial / JTAG | — |
| Tindminan RoHS | unknown | — |
| Logic Elements | — | 4,992 |
| System Gates | — | 100,000 (typical) |
| Embedded RAM Bits | — | 49,152 bits |
| Maximum User I/Os | — | 191 |
| Maximum Internal Frequency | — | 200 MHz |
| Core Supply Voltage | — | 2.5 V |
| I/O Supply Voltage | — | 3.3 V |
| Logic Family | — | CMOS |
| Speed Grade | — | -3 (faster) |
| JTAG Support | — | IEEE 1149.1-1990 compliant |
| PCI Compliance | — | PCI Local Bus Specification Rev 2.2 at 33/66 MHz |