EPF10K130EBC356-2 vs EPF10K200SBC356-1 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K130EBC356-2 sa pamamagitan ng Altera at EPF10K200SBC356-1 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K200SBC356-1 - 200K FLEX 10K FPGA, 274 I/O, 356-BGA | Intel / Altera
EPF10K200SBC356-1 NrndPagsanggunian na paghahambing
| Parametro | EPF10K130EBC356-2 | EPF10K200SBC356-1 |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | FLEX 10KE | FLEX 10K (Classic embedded array) |
| Logic Elements / Cells | 6,656 | 9,984 |
| Equivalent Gates | 130K | — |
| Logic Array Blocks (LABs) | 832 | — |
| Embedded Memory (EAB RAM) | 16 Kbits per EAB | — |
| User I/Os | 274 | — |
| Supply Voltage - Core | 2.375 V to 2.625 V (2.5 V nominal) | — |
| Logic Family | CMOS | — |
| Process Technology | 0.22 um | — |
| Maximum Internal Frequency | 333.33 MHz | — |
| Propagation Delay | 0.6 ns | 0.4 ns (-1 speed grade) |
| Speed Grade | -2 | — |
| Temperature na Operasyon | 0 C to +70 C (Commercial) | 0 °C to 70 °C (commercial) |
| Packhaging | 356-LBGA (35x35 mm) | 356-LBGA (35 x 35 mm, 1.27 mm pitch) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Configuration | In-system programmable (SRAM) | — |
| JTAG (IEEE 1149.1) | Yes | — |
| Tindminan RoHS | [DATA_NEEDED: rohs_status] | [DATA_NEEDED: RoHS status] |
| Number of LABs / CLBs | — | 1,248 |
| Total RAM Bits | — | 98,304 |
| Equivalent Gate Count | — | 200,000 (system gates ~513,000) |
| Number of User I/Os | — | 274 |
| Core Supply Voltage | — | 2.375 V to 2.625 V |
| Logic Family / Process | — | CMOS SRAM LUT |
| Configuration Method | — | SRAM (volatile) - requires configuration device or JTAG |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |