EPF10K130EFC672-2 vs EPF10K130EFC672-1X Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K130EFC672-2 sa pamamagitan ng Altera at EPF10K130EFC672-1X sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K130EFC672-2 EPF10K130EFC672-1X
Brand Altera Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Obsolete
Family FLEX 10KE FLEX 10KE
Logic Elements / Cells 6,656 —
Total Gates ~130,000 —
Logic Array Blocks (LABs) 832 832
Embedded Memory (RAM bits) 65,536 —
Maximum User I/Os 413 —
Number of I/O Pins 672 (package pins) —
Packhaging 672-ball FineLine BGA 672-ball FBGA, 27x27 mm, 1.0 mm pitch
Process Technology 0.22 µm CMOS 0.22 µm CMOS, SRAM-based
Core Supply Voltage 2.5 V —
Propagation Delay (typ.) 0.6 ns —
Internal Operating Frequency (max) 333.33 MHz —
Temperature na Operasyon 0 °C to +70 °C (Commercial) —
Speed Grade -2 -1X
Programming Method SRAM-based, JTAG (IEEE 1149.1) —
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount (BGA)
Series — FLEX 10KE®
Typical Gates — 130,000
Logic Elements (LEs) — 6,656
Total RAM Bits — 65,536
User I/Os — 413
Number of I/O Banks — 8
Core Voltage — 2.5 V (2.375 V to 2.625 V)
Internal Operating Frequency — up to 333.33 MHz
Operating Temperature (Commercial) — 0 °C to +70 °C
Configuration Mode — Passive Serial, JTAG, ByteBlaster
Moisture Sensitivity Level — MSL 3 (per JEDEC J-STD-020)
Tindminan RoHS — [DATA_NEEDED: RoHS compliance]
Lead-Free — [DATA_NEEDED: lead-free status]

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