EPF10K130EFC672-2X vs EPF10K130EFC672-2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K130EFC672-2X sa pamamagitan ng Intel at EPF10K130EFC672-2 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPF10K130EFC672-2X | EPF10K130EFC672-2 |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Series | FLEX 10KE | — |
| Number of Logic Elements (LEs) | 6656 | — |
| Number of Logic Array Blocks (LABs) | 832 | — |
| Total RAM Bits | 65536 | — |
| Number of User I/Os | 413 | — |
| Number of DLLs | 4 | — |
| Packhaging | 672-FBGA (FineLine BGA, 27x27 mm) | 672-ball FineLine BGA |
| Ball Pitch | 1.0 mm | — |
| Core Supply Voltage | 2.5 V (2.375 V to 2.625 V) | 2.5 V |
| I/O Supply Voltage | 3.3 V (MultiVolt I/O supports 5.0 V, 3.3 V, 2.5 V) | — |
| Temperature na Operasyon | 0C to +70C (commercial) | 0 °C to +70 °C (Commercial) |
| Process Technology | 0.22 μm CMOS SRAM | 0.22 µm CMOS |
| Configuration Method | Serial configuration device, JTAG | — |
| Logic Family | CMOS, SRAM-based | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | — |
| Family | — | FLEX 10KE |
| Logic Elements / Cells | — | 6,656 |
| Total Gates | — | ~130,000 |
| Logic Array Blocks (LABs) | — | 832 |
| Embedded Memory (RAM bits) | — | 65,536 |
| Maximum User I/Os | — | 413 |
| Number of I/O Pins | — | 672 (package pins) |
| Propagation Delay (typ.) | — | 0.6 ns |
| Internal Operating Frequency (max) | — | 333.33 MHz |
| Speed Grade | — | -2 |
| Programming Method | — | SRAM-based, JTAG (IEEE 1149.1) |