EPF10K200SBC356-2 vs EPF10K50VBC356-2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200SBC356-2 sa pamamagitan ng Altera at EPF10K50VBC356-2 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPF10K200SBC356-2 | EPF10K50VBC356-2 |
|---|---|---|
| Brand | Altera | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Huling Pagbili |
| Series | FLEX 10KS | FLEX 10K |
| Family | FLEX 10KS (Embedded Programmable Logic) | — |
| Logic Elements / Cells | 9984 | 2,880 |
| Logic Array Blocks (LABs) | 1248 | 360 |
| Embedded Memory Bits (EAB) | 98304 | — |
| System Gates | 200,000 | — |
| User I/Os | 274 | — |
| Number of I/O Banks | 8 | — |
| Supply Voltage (Core) | 2.5 V (2.375 V - 2.625 V) | — |
| I/O Voltage (PCI-compatible) | 3.3 V / 5.0 V tolerant | — |
| Propagation Delay | 0.4 ns (per datasheet) | 0.6 ns |
| Process Technology | 0.22 um CMOS | — |
| Temperature na Operasyon | 0C to +70C (Commercial) | 0 °C to +70 °C (Commercial) |
| Speed Grade | -2 | -2 |
| Packhaging | 356-LBGA (FineLine BGA, 35 x 35 mm, 1.27 mm pitch) | 356-LBGA (Low-profile BGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (Tray) |
| Configuration | SRAM-based (volatile, requires configuration device) | — |
| Boundary Scan | Yes (JTAG IEEE 1149.1) | — |
| PLL | Yes (on-chip) | — |
| Tindminan RoHS | Non-compliant (legacy part) | Not Compliant (per Arrow listing) |
| Logic Family / Process | — | CMOS, 0.42 µm |
| Typical Gate Count | — | 50,000 gates |
| Number of Flip-Flops | — | 20,480 |
| Maximum User I/Os | — | 274 |
| Internal Frequency (max) | — | 125 MHz |
| Operating Frequency (typ.) | — | 66.67 MHz |
| Core Supply Voltage | — | 3.3 V |
| Configuration Scheme | — | Serial Passive (PS) |
| Embedded Memory | — | EAB blocks, up to 2048 bits each |