EPF10K200SBI356-2 vs EPF10K200SBC356-1 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200SBI356-2 sa pamamagitan ng Altera at EPF10K200SBC356-1 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K200SBC356-1 - 200K FLEX 10K FPGA, 274 I/O, 356-BGA | Intel / Altera
EPF10K200SBC356-1 NrndPagsanggunian na paghahambing
| Parametro | EPF10K200SBI356-2 | EPF10K200SBC356-1 |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | FLEX 10KS | FLEX 10K (Classic embedded array) |
| Logic Elements | 9,984 | — |
| System Gates | 200,000 | — |
| Logic Array Blocks (LABs) | 1,248 | — |
| Embedded Array Blocks (EABs) | 24 (98,304 bits RAM) | — |
| User I/O Pins | 274 | — |
| Process Technology | 0.22 µm CMOS SRAM | — |
| Core Voltage | 2.5 V | — |
| Speed Grade | -2 | — |
| Packhaging | 356-BGA (SB) 35×35 mm, 1.27 mm pitch | 356-LBGA (35 x 35 mm, 1.27 mm pitch) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Maximum User I/O | 274 | — |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | 0 °C to 70 °C (commercial) |
| In-System Programmability | Yes (JTAG/ByteBlaster) | — |
| Configuration Method | SRAM-based, ISP | SRAM (volatile) - requires configuration device or JTAG |
| Level ng MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL level] |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Logic Elements / Cells | — | 9,984 |
| Number of LABs / CLBs | — | 1,248 |
| Total RAM Bits | — | 98,304 |
| Equivalent Gate Count | — | 200,000 (system gates ~513,000) |
| Number of User I/Os | — | 274 |
| Propagation Delay | — | 0.4 ns (-1 speed grade) |
| Core Supply Voltage | — | 2.375 V to 2.625 V |
| Logic Family / Process | — | CMOS SRAM LUT |