EPF10K200SBI356-2 vs EPF10K200SBC356-3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200SBI356-2 sa pamamagitan ng Altera at EPF10K200SBC356-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPF10K200SBI356-2 | EPF10K200SBC356-3 |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Family | FLEX 10KS | FLEX 10K |
| Logic Elements | 9,984 | — |
| System Gates | 200,000 | — |
| Logic Array Blocks (LABs) | 1,248 | 1,248 |
| Embedded Array Blocks (EABs) | 24 (98,304 bits RAM) | 12 |
| User I/O Pins | 274 | — |
| Process Technology | 0.22 µm CMOS SRAM | 0.22 um CMOS, 4 metal layers |
| Core Voltage | 2.5 V | — |
| Speed Grade | -2 | — |
| Packhaging | 356-BGA (SB) 35×35 mm, 1.27 mm pitch | PBGA-356 (35 x 35 mm, 1.27 mm pitch) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Maximum User I/O | 274 | — |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | 0 C to 70 C (Commercial) |
| In-System Programmability | Yes (JTAG/ByteBlaster) | — |
| Configuration Method | SRAM-based, ISP | — |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: rohs status] |
| Device Type | — | FPGA - Field Programmable Gate Array |
| Typical Gates | — | 200,000 |
| Logic Elements (Cells) | — | 9,984 |
| Total EAB RAM | — | 98,304 bits |
| User I/Os | — | 470 (package exposes 274 bonded-out) |
| Flip-Flops | — | 4,992 |
| Core Supply Voltage | — | 2.375 V to 2.625 V |
| Propagation Delay | — | 0.4 ns |
| Internal Performance (fmax) | — | 250 MHz |
| Configuration Mode | — | Passive Serial / Passive Parallel / JTAG |
| MultiVolt I/O | — | 2.5 V / 3.3 V / 5.0 V |
| Logic Family | — | CMOS |