EPF10K200SFI672-2N vs EPF10K200SFI672-2B Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200SFI672-2N sa pamamagitan ng Intel at EPF10K200SFI672-2B sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPF10K200SFI672-2N | EPF10K200SFI672-2B |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | FLEX 10KE | FLEX 10KE |
| Device Logic Elements | 9,984 | — |
| Typical Gates | 200,000 | — |
| Maximum System Gates | [DATA_NEEDED: maximum system gates] | 513,000 |
| Embedded Memory (EAB) | 12 EABs, 98,304 bits total | — |
| User I/Os | 470 | 470 |
| Process Technology | 0.22 um CMOS | 0.22 µm CMOS, SRAM |
| Core Supply Voltage | 2.5 V | 2.5 V |
| I/O Supply Voltage | 3.3 V (5.0 V tolerant) | — |
| Operating Temperature Grade | Industrial (-40C to +85C) | — |
| Speed Grade | -2 (mid) | — |
| Packhaging | 672-ball FBGA (FineLine BGA), 27 x 27 mm, 1.0 mm pitch | FBGA-672 (FineLine BGA, 27 × 27 mm, 1.0 mm pitch) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| JTAG Boundary-Scan | IEEE Std. 1149.1 compliant | — |
| Configuration Method | SRAM-based (requires external boot ROM) | — |
| Tindminan RoHS | Lead-free (N suffix) | Non-compliant (legacy FLEX 10KE) |
| Logic Elements | — | 9,984 |
| System Gates | — | 200,000 |
| Embedded Memory | — | 98,304 bits |
| Embedded Array Blocks (EABs) | — | 24 (96 Kbits total) |
| Maximum Operating Frequency | — | 200 MHz |
| PLLs | — | 4 |
| Temperature na Operasyon | — | -40 °C to +85 °C (Industrial) |
| Programming Memory Type | — | SRAM |