EPF10K250EBC600-3 vs EPF10K200SBC600-3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K250EBC600-3 sa pamamagitan ng Intel at EPF10K200SBC600-3 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPF10K250EBC600-3 | EPF10K200SBC600-3 |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements | 12,160 LEs | 9,984 cells |
| Typical Gates | 250,000 | — |
| Maximum User I/O | 470 | — |
| Embedded Array Blocks (EABs) | 12 (each 2 Kbits) | 12 |
| Total Embedded Memory | 24 Kbits (RAM) | — |
| PLLs (Phase-Locked Loops) | 4 | — |
| Dedicated Clock Inputs | 6 | — |
| Speed Grade | -3 | — |
| Core Supply Voltage | 3.3 V | — |
| I/O Supply Voltage | 3.3 V (5 V tolerant) | — |
| Packhaging | 600-ball FineLine BGA | 600-ball BGA (PBGA600, 45 x 45 mm, 1.27 mm pitch) |
| Configuration Mode | Passive Serial / Passive Parallel / JTAG | — |
| Boundary Scan | IEEE 1149.1 (JTAG) | — |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | 0 °C to 70 °C (commercial) |
| Process Technology | SRAM-based CMOS | 0.22 µm CMOS |
| Gate Count | — | 200,000 gates |
| Logic Array Blocks (LABs) | — | 1,248 |
| Embedded Memory | — | 98,304 bits |
| User I/Os | — | 470 |
| Core Voltage | — | 2.5 V |
| Maximum Internal Frequency | — | 166.67 MHz |
| Uri ng Pagpapasok | — | Surface Mount |
| Configuration Method | — | SRAM (external PROM required) |
| Programming Support | — | JTAG / Altera Quartus legacy |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS status] |
| Status | — | Obsolete (last Altera shipment) |