EPF10K250EGC599-2 vs EPF10K250EGC599-3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K250EGC599-2 sa pamamagitan ng Intel at EPF10K250EGC599-3 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
EPF10K250EGC599-3 - 250K Gate FLEX 10KE FPGA, 599-PGA | Intel
EPF10K250EGC599-3 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EPF10K250EGC599-2 | EPF10K250EGC599-3 |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Huling Pagbili |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements | 12,160 LEs | 12,160 |
| Typical Gates | 250,000 | 250,000 |
| Maximum User I/O Pins | 470 | — |
| Embedded Array Blocks (EABs) | 12 | 12 |
| Total RAM Bits | 24,576 bits | — |
| Number of PLLs | 4 | — |
| Speed Grade | -2 | -3 |
| Operating Temperature Grade | Commercial | Commercial (0C to +70C) |
| Core Voltage | 5 V | 3.3 V |
| Packhaging | 599-BCPGA (CPGA-599 / HIPGA-599) | 599-pin PGA (HIPGA / Heat-dissipating PGA) |
| Uri ng Pagpapasok | Through-Hole (Pin Grid Array) | Through-hole PGA |
| Configuration Method | SRAM / EPROM | Serial or parallel, SRAM configuration cell |
| JTAG Support | IEEE 1149.1 Boundary Scan | — |
| Tindminan RoHS | Unknown (legacy ceramic PGA) | [DATA_NEEDED: RoHS compliance status] |
| Katayuan ng Lifecycle | Not Recommended for New Designs (NRND) | — |
| Embedded Memory (Bits) | — | 409,600 |
| Maximum User I/O | — | 470 |
| Package Pin Count | — | 599 |
| I/O Voltage Support | — | 3.3 V / 2.5 V / 1.8 V (MultiVolt) |
| Process Technology | — | 0.22 micron CMOS, SRAM-based configuration |
| Terminal Form | — | PIN/PEG |