EPF10K250EGC599-3 vs EPF10K250EGC599-2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K250EGC599-3 sa pamamagitan ng Altera at EPF10K250EGC599-2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
EPF10K250EGC599-3 - 250K Gate FLEX 10KE FPGA, 599-PGA | Intel
EPF10K250EGC599-3 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EPF10K250EGC599-3 | EPF10K250EGC599-2 |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements | 12,160 | 12,160 LEs |
| Typical Gates | 250,000 | 250,000 |
| Embedded Memory (Bits) | 409,600 | — |
| Embedded Array Blocks (EABs) | 12 | 12 |
| Maximum User I/O | 470 | — |
| Packhaging | 599-pin PGA (HIPGA / Heat-dissipating PGA) | 599-BCPGA (CPGA-599 / HIPGA-599) |
| Package Pin Count | 599 | — |
| Speed Grade | -3 | -2 |
| Operating Temperature Grade | Commercial (0C to +70C) | Commercial |
| Core Voltage | 3.3 V | 5 V |
| I/O Voltage Support | 3.3 V / 2.5 V / 1.8 V (MultiVolt) | — |
| Process Technology | 0.22 micron CMOS, SRAM-based configuration | — |
| Configuration Method | Serial or parallel, SRAM configuration cell | SRAM / EPROM |
| Uri ng Pagpapasok | Through-hole PGA | Through-Hole (Pin Grid Array) |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | Unknown (legacy ceramic PGA) |
| Terminal Form | PIN/PEG | — |
| Maximum User I/O Pins | — | 470 |
| Total RAM Bits | — | 24,576 bits |
| Number of PLLs | — | 4 |
| JTAG Support | — | IEEE 1149.1 Boundary Scan |
| Katayuan ng Lifecycle | — | Not Recommended for New Designs (NRND) |