EPF10K30EFC256-2XN vs EPF10K30EFC256-3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K30EFC256-2XN sa pamamagitan ng Altera at EPF10K30EFC256-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
EPF10K30EFC256-2XN - 30K FLEX-10KE FPGA, 256-BGA, Industrial | Altera
EPF10K30EFC256-2XN ⚠ Huling Pagbili
Pagsanggunian na paghahambing
| Parametro | EPF10K30EFC256-2XN | EPF10K30EFC256-3 |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Obsolete |
| Family | FLEX 10KE | FLEX 10KE |
| Typical Gates | 30,000 | 30,000 |
| Logic Elements | 1,728 | — |
| Logic Cells | 1,728 | — |
| Embedded RAM Bits | 24,576 (6 x 4,096-bit EABs) | 24,576 |
| User I/O Pins | 176 | 176 |
| Logic Blocks (LABs) | 216 | — |
| Process Technology | 0.22 micrometer CMOS, 4-layer metal | 0.22 micrometer CMOS |
| Core Supply Voltage | 2.5 V (2.375 V to 2.625 V) | — |
| Internal Frequency (max) | 200 MHz | — |
| Speed Grade | -2 | -3 (fastest) |
| I/O Standards Supported | 3.3 V, 5.0 V (MultiVolt I/O) | — |
| Temperature na Operasyon | -40 C to +85 C (Industrial, 'N' suffix) | — |
| Packhaging | 256-ball FBGA, 17x17 mm | 256-ball FineLine BGA |
| Configuration Interface | JTAG / serial via EPC EEPROM | Serial (EPC8/EPC16) and JTAG (IEEE 1149.1) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes (per 'N' suffix) | — |
| Level ng MSL | 3 (168 hours) | — |
| Logic Elements / Cells | — | 1,728 |
| Logic Array Blocks (LABs) | — | 216 |
| Maximum Operating Frequency | — | 200 MHz |
| Core Supply Voltage (VCCINT) | — | 2.5 V |
| I/O Supply Voltage (VCCIO) | — | 3.3 V (multi-voltage I/O standard support) |
| Temperature Grade | — | Commercial |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS status] |