EPF10K30ETC144-2 vs EPF10K50ETC144-1 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K30ETC144-2 sa pamamagitan ng Intel at EPF10K50ETC144-1 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPF10K30ETC144-2 | EPF10K50ETC144-1 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Series | FLEX 10KE | FLEX 10KE |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements | 1,728 | — |
| Typical Gates | 30,000 | 50,000 |
| Maximum User I/Os | 102 | — |
| Logic Array Blocks (LABs) | 216 | 360 |
| Embedded Memory Bits | 24,576 | — |
| Embedded Array Blocks (EABs) | 6 | — |
| Packhaging | 144-LQFP (TQFP, 20x20 mm) | 144-LQFP (TQFP) |
| Speed Grade | -2 | — |
| Temperature na Operasyon | 0C to +70C (Commercial) | 0 °C to +70 °C (Commercial) |
| Core Voltage (VCCINT) | 2.5 V (2.375 V to 2.625 V) | — |
| I/O Voltage (VCCIO) | 2.5 V / 3.3 V / 5.0 V (MultiVolt) | — |
| Internal Frequency | up to 80 MHz | — |
| Propagation Delay (typ.) | 0.6 ns | — |
| Configuration Method | SRAM, JTAG (IEEE 1149.1) | — |
| Process Technology | CMOS, SRAM-based | CMOS |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant (lead-free) | [DATA_NEEDED: rohs_status] |
| Logic Elements (LEs) | — | 2,880 |
| Embedded Memory (RAM bits) | — | 40,960 |
| Number of User I/O | — | 102 |
| Number of I/O Pins (package) | — | 144 |
| Core Voltage | — | 2.5 V |
| Internal Frequency (max) | — | 66.67 MHz |
| Propagation Delay | — | 0.6 ns |