EPF6016AFC256-3 vs EPF6010ATC100-3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF6016AFC256-3 sa pamamagitan ng Intel at EPF6010ATC100-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPF6016AFC256-3 | EPF6010ATC100-3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Family | FLEX 6000 | FLEX 6000 |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Equivalent Gates | 16K | — |
| Logic Elements (LEs) | 1320 | — |
| Logic Array Blocks (LABs) | 132 | 88 |
| User I/Os | 171 | — |
| Maximum Internal Frequency | 142.86 MHz | — |
| Edge Rate | 172 MHz | — |
| Process Technology | 0.42 µm CMOS | 0.42 µm CMOS SRAM |
| Core Supply Voltage | 3.3 V | — |
| Packhaging | 256-ball FineLine BGA (FBGA) | TQFP-100 (100-pin) |
| Bilang ng Pin | 256 | — |
| Speed Grade | -3 | -3 (commercial, slowest grade) |
| Configuration Method | SRAM (volatile, requires external PROM) | — |
| Programming Interface | JTAG (IEEE 1149.1) | — |
| Temperature na Operasyon | 0 °C to +85 °C (commercial) | 0C to +70C (commercial) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Logic Elements / Cells | — | 880 |
| Usable Gates | — | 10,000 |
| User I/O Pins | — | 71 |
| Supply Voltage (VCCINT) | — | 3.3 V |
| I/O Voltage Tolerance | — | 3.3 V / 5 V tolerant |
| Configuration Memory | — | SRAM (external configuration device required) |
| JTAG Support | — | Yes (IEEE 1149.1) |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS status] |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |