EPM2210F256C4 vs EPM2210F256C5N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPM2210F256C4 sa pamamagitan ng Altera at EPM2210F256C5N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPM2210F256C4 | EPM2210F256C5N |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | MAX II | — |
| Logic Elements | 2,210 | 2210 |
| Equivalent Macrocells | 1,700 | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| User I/O Pins | 212 | — |
| Packhaging | 256-ball FineLine BGA (FBGA) | 256-ball FineLine BGA (17x17mm, 1mm pitch) |
| Process Technology | 0.18 µm 6-layer-metal flash | 0.18 um CMOS with on-chip flash |
| Core Supply Voltage | 1.8 V | — |
| I/O Supply Voltage (MultiVolt) | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Pin-to-pin Delay (tPD1) | 7 ns | — |
| Maximum Frequency (fMAX) | 201 MHz | — |
| Temperature na Operasyon | 0 °C to +85 °C (commercial extended) | 0C to +85C (commercial) |
| Programming Interface | JTAG (IEEE 1149.1) ISP | JTAG (IEEE 1149.1) / ByteBlaster / USB-Blaster |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Family | — | MAX II |
| Macrocells | — | 1700 |
| User I/Os | — | 204 |
| Propagation Delay (tPD) | — | 7 ns |
| Turn-On Delay (tSU) | — | 11.2 ns |
| Maximum Internal Frequency | — | 201.1 MHz |
| Supply Voltage (VCCINT) | — | 2.375 V to 3.6 V (3.3 V typical) |
| I/O Voltage Standards | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Global Clocks | — | 4 |
| Configuration Memory | — | Internal flash (non-volatile, instant-on) |
| Lead-Free | — | Yes |