EPM2210GF324C4N vs EPM2210F324I8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPM2210GF324C4N sa pamamagitan ng Intel at EPM2210F324I8N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPM2210GF324C4N | EPM2210F324I8N |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX II | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) | — |
| Logic Elements | 2,210 | — |
| Equivalent Macrocells | 1,700 | — |
| User I/Os (max) | 272 | — |
| User Flash Memory (UFM) | 8 Kbits | — |
| Supply Voltage - Core (VCCINT) | 1.8 V | — |
| MultiVolt I/O Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V | — |
| Maximum Internal Frequency | 247.5 MHz | — |
| Pin-to-Pin Logic Delay (tPD) | 7.0 ns (C4 speed grade) | — |
| Process Technology | 0.18 µm 6-layer-metal flash | 0.18 micron |
| Packhaging | 324-ball FineLine BGA (GF324) | FBGA-324 (F324) |
| Programming Interface | IEEE 1149.1 JTAG (ISP) | JTAG (IEEE 1149.1) |
| Operating Temperature (commercial) | 0 °C to +85 °C | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Device Logic Elements | — | 2210 LEs |
| User I/O Count | — | 272 |
| Hanay ng Temperature na Operasyon | — | -40C to +100C (Industrial, I8N) |
| Supply Voltage (Core) | — | 1.8 V |
| Standby Current | — | 25 uA typical |
| Propagation Delay (tPD) | — | [DATA_NEEDED: tPD value ns] |
| Clock-to-Output Time (tCO) | — | [DATA_NEEDED: tCO value ns] |
| Configuration Memory | — | On-chip Flash, instant-on |
| User Flash Memory | — | [DATA_NEEDED: UFM size Kbits] |
| Number of LABs | — | [DATA_NEEDED: LAB count] |
| I/O Standards Supported | — | LVTTL, LVCMOS, PCI, SSTL |
| Internal Oscillator | — | Yes |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |