EPM2210GF324I5 vs EPM2210GF324C4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPM2210GF324I5 sa pamamagitan ng Altera at EPM2210GF324C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
EPM2210GF324I5 - 2210 LE MAX II CPLD, 212 I/O, FBGA-324 | Altera / Intel
EPM2210GF324I5 ✓ Nakahanda
Pagsanggunian na paghahambing
| Parametro | EPM2210GF324I5 | EPM2210GF324C4N |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX II | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) | CPLD (Complex Programmable Logic Device) |
| Logic Elements (LEs) | 2,210 | — |
| Equivalent Macrocells | 1,700 | 1,700 |
| User I/Os (max) | 272 | 272 |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Propagation Delay (tPD1, max) | 7 ns (industrial speed grade I5) | — |
| Core Supply Voltage (VCCINT) | 1.8 V | — |
| I/O Supply Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) | — |
| Temperature na Operasyon | -40 °C to +100 °C (industrial grade, suffix I) | — |
| Packhaging | FBGA-324 (FineLine BGA, 19 x 19 mm, 1.0 mm pitch) | 324-ball FineLine BGA (GF324) |
| Uri ng Pagpapasok | Surface Mount | — |
| Process Technology | 0.18 µm 6-layer-metal flash CMOS | 0.18 µm 6-layer-metal flash |
| Programming Interface | JTAG (IEEE 1149.1) / ISP | IEEE 1149.1 JTAG (ISP) |
| Tindminan RoHS | Compliant (Pb-free) | Compliant |
| Logic Elements | — | 2,210 |
| Supply Voltage - Core (VCCINT) | — | 1.8 V |
| MultiVolt I/O Support | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V |
| Maximum Internal Frequency | — | 247.5 MHz |
| Pin-to-Pin Logic Delay (tPD) | — | 7.0 ns (C4 speed grade) |
| Operating Temperature (commercial) | — | 0 °C to +85 °C |