EPM570GF256C4N vs EPM570GF256C3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPM570GF256C4N sa pamamagitan ng Altera at EPM570GF256C3 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
EPM570GF256C4N - 570 LEs CPLD, 4ns, 212 I/O, FBGA-256 | Intel / Altera
EPM570GF256C4N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EPM570GF256C4N | EPM570GF256C3 |
|---|---|---|
| Brand | Altera | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX II G | MAX II |
| Device Series | EPM570G | — |
| Logic Elements (LEs) | 570 | — |
| Macrocells | 440 | — |
| User I/Os | 212 | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbit |
| Speed Grade | C4 (tPD = 4 ns) | — |
| Pin-to-Pin Delay (tPD) | 4 ns | — |
| Internal fMAX | 304 MHz | — |
| Packhaging | 256-ball FineLine BGA (FBGA-256) | FBGA-256 (FineLine BGA), 17 x 17 mm, 1.0 mm pitch, lead-free |
| Ball Pitch | 1.0 mm | — |
| Package Dimensions | 17 x 17 mm | — |
| Core Voltage | 1.8 V | — |
| I/O Bank Voltages (MultiVolt) | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Temperature na Operasyon | -40 °C to +125 °C (industrial) | — |
| Configuration Memory | Flash (non-volatile, instant-on) | — |
| Programming Interface | JTAG (IEEE 1149.1), in-system programmable | JTAG (IEEE 1149.1) / ISP |
| Lead-Free / RoHS | Lead-free, FBGA package | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Device Model | — | EPM570 |
| Logic Elements (LE) | — | 570 |
| Equivalent Macrocells | — | 440 |
| User I/Os (max, FBGA-256) | — | 212 |
| Propagation Delay tPD1 | — | 8.7 ns (C3 speed grade) |
| Internal Performance fMAX | — | 300 MHz |
| Process Technology | — | 0.18 um 6-layer-metal flash |
| Supply Voltage VCCINT | — | 1.8 V (core, MultiVolt) |
| I/O Bank Voltage VCCIO | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Operating Temperature (commercial) | — | -40 C to +125 C per 3rd-party spec (Altera commercial: 0 C to +85 C) |
| Tindminan RoHS | — | Compliant (lead-free) |
| Level ng MSL | — | 3 (per JEDEC J-STD-020, typical for FBGA) |
| Vertical Migration Within FBGA-256 | — | Supported across EPM570 / EPM1270 / EPM2210 |