EPM570GF256C5 vs EPM570GF256C4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPM570GF256C5 sa pamamagitan ng Intel at EPM570GF256C4N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
EPM570GF256C4N - 570 LEs CPLD, 4ns, 212 I/O, FBGA-256 | Intel / Altera
EPM570GF256C4N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EPM570GF256C5 | EPM570GF256C4N |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX II | MAX II G |
| Logic Elements (LE) | 570 | — |
| Macrocells | 440 | 440 |
| Maximum User I/Os | 76 | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Pin-to-Pin Logic Delay | 5.4 ns (tPD1, -5 speed grade) | — |
| Maximum Operating Frequency | 201.1 MHz (fCNT, internal) | — |
| Supply Voltage - Core | 1.8 V (internal LDO) | — |
| Supply Voltage - I/O (VCCIO) | 3.3 V / 2.5 V / 1.8 V (MultiVolt) | — |
| Temperature na Operasyon | -40 C to +125 C | -40 °C to +125 °C (industrial) |
| Packhaging | 256-ball FineLine BGA, 11 x 11 mm, 1.0 mm pitch | 256-ball FineLine BGA (FBGA-256) |
| Process Technology | 0.18 micron flash CMOS | — |
| Configuration | Non-volatile flash, instant-on (ISP) | — |
| Program Memory Type | Flash (internal) | — |
| JTAG Support | Yes (IEEE 1149.1) | — |
| Tindminan RoHS | Compliant (lead-free FBGA) | — |
| Logic Family | CMOS | — |
| Device Series | — | EPM570G |
| Logic Elements (LEs) | — | 570 |
| User I/Os | — | 212 |
| Speed Grade | — | C4 (tPD = 4 ns) |
| Pin-to-Pin Delay (tPD) | — | 4 ns |
| Internal fMAX | — | 304 MHz |
| Ball Pitch | — | 1.0 mm |
| Package Dimensions | — | 17 x 17 mm |
| Core Voltage | — | 1.8 V |
| I/O Bank Voltages (MultiVolt) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Configuration Memory | — | Flash (non-volatile, instant-on) |
| Programming Interface | — | JTAG (IEEE 1149.1), in-system programmable |
| Lead-Free / RoHS | — | Lead-free, FBGA package |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |