EPM570ZM256C6N vs EPM570ZM256I8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPM570ZM256C6N sa pamamagitan ng Altera at EPM570ZM256I8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPM570ZM256C6N | EPM570ZM256I8N |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | MAX II | MAX II |
| Logic Elements (LEs) | 570 | — |
| Macrocells | 440 | — |
| User I/Os | 160 | — |
| User Flash Memory | 8 Kbits | 8 Kbit |
| Packhaging | 256-MBGA (FineLine BGA) 11x11 mm | 256-MBGA (Micro FBGA), 11 mm x 11 mm |
| Pin/Pitch | 256 balls, 0.5 mm pitch (Heisener description) | — |
| Internal Core Voltage | 1.71 V to 1.89 V (1.8 V typical) | — |
| I/O Voltage Standards | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V tolerant | — |
| Propagation Delay (tPD) | 9 ns (per Heisener listing for Z speed grade) | — |
| Programmable Type | In System Programmable (Flash, non-volatile) | In System Programmable (ISP) via JTAG |
| Temperature na Operasyon | 0C to +85C (commercial) | -40 C to +100 C (Industrial) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Process Technology | 0.18 micron CMOS, 6-layer-metal flash | 0.18 micrometer, 6-layer-metal flash |
| Tindminan RoHS | Lead-free (per Heisener listing) | Compliant |
| Family | — | MAX II Z (zero-power, 1.8 V core) |
| Macro Cells | — | 440 |
| Logic Elements | — | 570 |
| Maximum Internal Frequency | — | 118.3 MHz |
| Number of Logic Array Blocks (LABs) | — | 57 |
| Macrocells per LAB | — | 16 |
| Number of Global Clocks | — | 4 |
| Core Supply Voltage (VCCINT) | — | 1.71 V to 1.89 V |
| MultiVolt I/O Bank Supply | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| User I/O Pins (max) | — | 212 |
| Propagation Delay (tPD1) | — | 9.9 ns |