K4AAG165WA-BCRC vs K4AAG165WM-BCTD Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng K4AAG165WA-BCRC sa pamamagitan ng Samsung Electronics at K4AAG165WM-BCTD sa pamamagitan ng Samsung Electronics. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Samsung Electronics
K4AAG165WA-BCRC - 16Gb DDR4 SDRAM, FBGA-96 | Samsung | DRAM
K4AAG165WA-BCRC ✓ NakahandaSamsung Electronics
K4AAG165WM-BCTD - 16Gb DDR4 SDRAM 2666Mbps | Samsung
K4AAG165WM-BCTD ✓ NakahandaPagsanggunian na paghahambing
| Parametro | K4AAG165WA-BCRC | K4AAG165WM-BCTD |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Kategorya | DRAM | Memory ICs |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Uri ng Memory | DDR4 SDRAM (Volatile DRAM) | DDR4 SDRAM |
| Laki ng Memory | 16 Gb (2 GB) | — |
| Memory Organization | 1G x 16 | — |
| Memory Interface | DDR4 SDRAM Interface | — |
| Volte ng Pagbibigay | 1.2 V | 1.2 V (1.14 V to 1.26 V) |
| Rate ng Data | up to 3200 Mbps per pin (family); [DATA_NEEDED: BCRC speed grade rating] | — |
| Technology | DDR4 | — |
| Packhaging | FBGA-96 (96-ball Fine-Pitch Ball Grid Array) | 96FBGA (96-ball Fine-Pitch Ball Grid Array) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA solder reflow) |
| Temperature na Operasyon | [DATA_NEEDED: BCRC temperature range; family BCWE rated -40C to +95C] | 0C to +85C |
| Speed Grade Suffix | -BCRC | — |
| Datasheet | Samsung K4AAG165WA DDR4 SDRAM Memory, 23 pages | — |
| Packaging Status | [DATA_NEEDED: tray/reel standard quantity] | — |
| Clock Frequency | [DATA_NEEDED: BCRC clock frequency] | — |
| Memory Format | DRAM | — |
| Tindminan RoHS | unknown | RoHS (per LCSC listing) |
| Density | — | 16 Gb |
| Organisasyon | — | 1G x 16 |
| Speed | — | 2666 Mbps |
| Interface | — | SSTL-12 |
| Auto Precharge | — | Yes |
| Asynchronous Reset | — | Yes |
| CRC Function | — | Yes |
| ZQ Calibration | — | Yes |
| Dynamic On-Chip Termination | — | Yes |
| Data Mask | — | Yes |