M1AFS1500-1FG484I vs M1AFS1500-1FGG484I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng M1AFS1500-1FG484I sa pamamagitan ng Microchip Technology at M1AFS1500-1FGG484I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
M1AFS1500-1FG484I - 1.5M Gate Fusion FPGA 484-FBGA | Microchip
M1AFS1500-1FG484I ✓ NakahandaMicrochip Technology
M1AFS1500-1FGG484I - 1.5M Gate Fusion Mixed-Signal FPGA | Microchip
M1AFS1500-1FGG484I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | M1AFS1500-1FG484I | M1AFS1500-1FGG484I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Fusion (M1) | — |
| Number of System Gates | 1500000 | — |
| Logic Capacity | 276480 | — |
| Number of I/O | 223 | — |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) | 1.5 V |
| Speed Grade | -1 | -1 |
| Embedded Processor | ARM Cortex-M1 soft core support | ARM Cortex-M1 |
| Programmable Technology | Flash-based (non-volatile) | — |
| Process Technology | 130 nm | 130 nm flash-based |
| Security | 128-bit flash lock, AES decryption | — |
| Temperature na Operasyon | -40C to +100C (TJ) | — |
| Packhaging / Kaso | 484-BGA (FBGA / FPBGA) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Tindminan RoHS | RoHS Non-Compliant | [DATA_NEEDED: RoHS status] |
| Lead Free Status | Contains Lead | — |
| Manufacturer Lead Time | 16 weeks | — |
| Product Status | Active | — |
| Manufacturer | — | Microchip Technology (originally Microsemi Corporation) |
| Family | — | Fusion Mixed-Signal FPGA |
| System Gates | — | 1500000 gates |
| Logic Cells | — | 38400 |
| User I/O | — | 223 |
| Flash Fabric Bits | — | 276480 bits |
| Packhaging | — | 484-ball Fine-Pitch BGA (FGG484), 1.00 mm pitch |
| Package Dimensions | — | 23 mm x 23 mm |
| Temperature Grade | — | Industrial (-40C to +100C, I suffix) |
| Analog Blocks | — | Configurable analog (ADC-based system monitoring) |
| Clock Management | — | On-chip CCC clock conditioning and generation |
| Configuration Memory | — | On-chip flash (single-chip, instant-on) |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |