M1AFS250-1FG256I vs M1AFS250-FG256 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng M1AFS250-1FG256I sa pamamagitan ng Microchip Technology at M1AFS250-FG256 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
M1AFS250-1FG256I - 250K Gate Fusion FPGA, 114 I/O | Microchip
M1AFS250-1FG256I ✓ NakahandaMicrochip Technology
M1AFS250-FG256 - Fusion FPGA 250K Gates ARM Cortex-M1 | Microchip
M1AFS250-FG256 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | M1AFS250-1FG256I | M1AFS250-FG256 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Fusion (M1 - with ARM Cortex-M1) | M1AFS250 |
| System Gates | 250000 gates | 250000 |
| D Flip-Flops (DFF) | 36864 | — |
| Total I/O | 114 | — |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) | 1.5 V |
| Configuration Type | Flash-based (live at power-up) | — |
| Embedded Processor | ARM Cortex-M1 soft core | ARM Cortex-M1 |
| Analog Features | Configurable analog blocks, clock generation and management | — |
| On-chip Memory | Flash memory blocks | — |
| Temperature na Operasyon | -40C to +85C (industrial, suffix I) | — |
| Speed Grade | -1 | — |
| Packhaging | 256-LBGA (FBGA) | — |
| Package Dimensions | 17 mm x 17 mm x 1.2 mm height | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Supplier Device Package | 256-LBGA | — |
| Total RAM | [DATA_NEEDED: Total RAM bits] | — |
| Embedded Block RAM (eSRAM) | [DATA_NEEDED: eSRAM size] | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Manufacturer Part Number | — | M1AFS250-FG256 |
| Family | — | Fusion (M1 series, ARM Cortex-M1) |
| Logic Cells | — | 6144 |
| Maksimum na Taktiko ng Oras | — | 350 MHz |
| Number of I/O | — | 114 |
| RAM Bits | — | 36864 |
| Process Technology | — | 130 nm |
| Configuration Memory | — | Flash (nonvolatile) |
| Hanay ng Temperature na Operasyon | — | 0C to +70C |
| Packhaging / Kaso | — | 256-FBGA (256-LBGA), 1.00 mm pitch |
| Style ng Pagpapasok | — | SMD/SMT |
| Packaging | — | Tray |
| Tindminan RoHS | — | RoHS Non-Compliant (contains lead) |
| Lead Free Status | — | Contains Lead |