M1AFS250-2FGG256 vs M1AFS250-2FG256I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng M1AFS250-2FGG256 sa pamamagitan ng Microchip Technology at M1AFS250-2FG256I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
M1AFS250-2FGG256 - Fusion FPGA 250K Gates ARM M1 | Microchip
M1AFS250-2FGG256 ✓ NakahandaMicrochip Technology
M1AFS250-2FG256I - 250K Gate Fusion FPGA, ARM M1 | Microchip
M1AFS250-2FG256I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | M1AFS250-2FGG256 | M1AFS250-2FG256I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Fusion (M1 series) Mixed-Signal FPGA | Fusion (M1AFS, ARM Cortex-M1 support) |
| System Gates | 250000 gates | 250K |
| Registers (D-Flip-Flops) | 36864 | — |
| User I/O | 114 | 114 |
| Embedded Processor | ARM Cortex-M1 | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Process Technology | 130 nm flash-based | 130 nm, 7-layer metal flash-based CMOS |
| Configuration Memory | Flash (in-system programmable, instant-on) | Flash-based, nonvolatile |
| Analog Features | Configurable analog block, voltage monitoring | — |
| Clock Management | On-chip clock generation and management circuitry | — |
| Packhaging | 256-LBGA (FGG256) | 256-ball FBGA (256-LBGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | — |
| Speed Grade | -2 | -2 |
| Total RAM | [DATA_NEEDED: embedded flash memory capacity] | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | RoHS Non-Compliant (contains lead; FGG variant is lead-free) |
| Level ng MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Embedded RAM Bits | — | 36864 |
| System Performance | — | 350 MHz |
| Processor Core | — | ARM Cortex-M1 (hard IP) |
| Power-Up Mode | — | Live at Power-Up (LAPU) |
| Analog Block | — | Configurable analog (voltage, current, temperature monitoring) |
| Temperature Range | — | Industrial (-40C to +85C) |
| Packaging | — | Tray |