M2GL090-FG676 vs M2GL090-FG676I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng M2GL090-FG676 sa pamamagitan ng Microchip Technology at M2GL090-FG676I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
M2GL090-FG676 - 86K IGLOO2 FPGA, 1.2V, 676-FBGA | Microchip
M2GL090-FG676 ✓ NakahandaMicrochip Technology
M2GL090-FG676I - 86K LEs, 425 I/O IGLOO2 FPGA | Microchip
M2GL090-FG676I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | M2GL090-FG676 | M2GL090-FG676I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Device Type | IGLOO2 low-density FPGA | IGLOO2 field programmable gate array |
| Logic Cells | 86,316 cells | — |
| Configuration Memory | 2,648,064 bits | Flash |
| I/O Count | 425 I/O | 425 I/O |
| Volte ng Pagbibigay | 1.2 V | — |
| Packhaging | 676-pin FBGA | 676-ball BGA |
| Device Family | IGLOO2 | — |
| FPGA Type | Field-programmable gate array | — |
| Programmable Logic | FPGA programmable logic fabric | — |
| Embedded Memory | IGLOO2 FPGA embedded memory resources | — |
| Uri ng Pagpapasok | Surface-mount FBGA | Surface Mount |
| Manufacturer Product Status | In Production | — |
| General-Purpose Application | Secure connectivity | — |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| REACH Status | [DATA_NEEDED: REACH status] | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | [DATA_NEEDED: automotive qualification status] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Logic Elements | — | 86,000 logic elements |
| Package Type | — | Surface-mount BGA |
| Package Pin Count | — | 676 balls |
| Package Shape | — | Square |
| Terminal Form | — | Ball |
| Temperature Grade | — | Industrial |
| Core Supply Voltage | — | 1.2 V |
| Programmable Logic Type | — | Low-density flash FPGA |
| Primary Application | — | General-purpose programmable logic |
| Supported Functions | — | Bridging, I/O expansion, system management, secure connectivity |
| Katayuan ng Lifecycle | — | In Production |
| AEC-Q100 Status | — | [DATA_NEEDED: AEC-Q100 qualification status] |