M7AFS600-1FG256 vs M7AFS600-1FG256I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng M7AFS600-1FG256 sa pamamagitan ng Microchip Technology at M7AFS600-1FG256I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
M7AFS600-1FG256 - Fusion FPGA 600K Gates 256-FBGA | Microchip
M7AFS600-1FG256 ✓ NakahandaMicrochip Technology
M7AFS600-1FG256I - Fusion Mixed-Signal FPGA 600K Gates | Microchip
M7AFS600-1FG256I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | M7AFS600-1FG256 | M7AFS600-1FG256I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Logic Family | Microsemi Fusion (M7AFS600) | — |
| System Gates | 600K | 600K |
| Embedded Processor Core | ARM CoreMP7 (32-bit) | — |
| Embedded Flash Configuration Memory | 110592 bits | — |
| Number of User I/O | 119 | — |
| Core Supply Voltage | 1.5 V | — |
| Core Supply Voltage Range | 1.425 V to 1.575 V | — |
| Process Technology | 130 nm flash-based | 130 nm, 7-layer metal flash-based CMOS |
| Configuration Type | Non-volatile Flash, single-chip, instant-on | — |
| Maximum Frequency | 1282.05 MHz (per distributor listing) | — |
| Packhaging | 256-ball FBGA/LBGA (FG256) | 256-LBGA |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | -40C to +85C | -40C to +85C |
| Packaging | Tray | — |
| Speed Grade | -1 (standard) | 1 |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Total Package Balls | 256 | — |
| Family | — | Fusion Mixed-Signal FPGA |
| Processor Support | — | ARM CoreMP7 |
| Number of I/O | — | 119 |
| Total Memory Bits | — | 110592 |
| Maximum System Performance | — | 350 MHz |
| Program Memory Type | — | Flash (nonvolatile) |
| Core Voltage | — | 1.5 V |
| Live at Power-Up (LAPU) | — | Yes |
| Temperature Grade | — | I (Industrial) |
| Configuration Retention | — | Retains program when powered off |