M7AFS600-1FGG484I vs M7AFS600-1FG484I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng M7AFS600-1FGG484I sa pamamagitan ng Microchip Technology at M7AFS600-1FG484I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
M7AFS600-1FGG484I - 600K Gate Fusion FPGA, 172 I/O | Microchip
M7AFS600-1FGG484I ✓ NakahandaMicrochip Technology
M7AFS600-1FG484I - Fusion FPGA 600K Gates, 484 FBGA | Microchip
M7AFS600-1FG484I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | M7AFS600-1FGG484I | M7AFS600-1FG484I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Fusion (M7AFS600) | — |
| System Gates | 600000 | 600000 |
| Number of I/Os | 172 | — |
| Total RAM Bits | 110592 | — |
| Embedded Processor | ARM CoreMP7 | — |
| Volte ng Pagbibigay | 1.5 V | — |
| Supply Voltage Range | 1.425 V to 1.575 V | — |
| Maximum Operating Frequency | 1282.05 MHz | — |
| Process Technology | 130 nm | 130 nm, 7-layer metal, Flash-based CMOS |
| Speed Grade | 1 (M7, fastest family grade) | 1 |
| Temperature na Operasyon | -40C to +85C | Industrial, -40C to +85C |
| Packhaging / Kaso | 484-BGA (FBGA) | — |
| Supplier Device Package | 484-FPBGA (23x23) | — |
| Style ng Pagpapasok | SMD/SMT | — |
| Packaging | Tray | — |
| Programmable Type | Flash-based, In-System Programmable | — |
| Tindminan RoHS | ROHS3 Compliant | Compliant |
| Manufacturer Lead Time | 16 weeks | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Number of Logic Cells | [DATA_NEEDED: logic cell count] | — |
| Programmable Logic Tiles | — | 110592 |
| User I/O | — | 172 |
| Family | — | Fusion (Flash FPGA with optional ARM CoreMP7 support) |
| Configuration Memory | — | Nonvolatile Flash, retains program when powered off |
| Power-Up Feature | — | Live at Power-Up (LAPU) |
| Supply Voltage (Core) | — | 1.5 V |
| Logic Family | — | CMOS |
| Packhaging | — | 484-ball FBGA (FG484), 23 x 23 x 2.44 mm |
| Ball Pitch | — | 1.0 mm |
| Uri ng Pagpapasok | — | Surface Mount |
| Embedded Processor Support | — | ARM CoreMP7 |