M7AFS600-FGG256 vs AFS600-FGG256I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng M7AFS600-FGG256 sa pamamagitan ng Microchip Technology at AFS600-FGG256I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
M7AFS600-FGG256 - Fusion FPGA 600K Gates 256-BGA | Microchip
M7AFS600-FGG256 ✓ NakahandaMicrochip Technology
AFS600-FGG256I - 600K Gate Fusion FPGA | Microchip Technology
AFS600-FGG256I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | M7AFS600-FGG256 | AFS600-FGG256I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Fusion (M7AFS600) | — |
| System Gates | 600K | 600,000 gates |
| Flip-Flops | 110592 | — |
| User I/O | 119 | — |
| Embedded Processor | ARM CoreMP7 | — |
| Core Supply Voltage | 1.5 V | — |
| Process Technology | 130 nm flash-based | 130 nm CMOS |
| Maximum Frequency | 1098.9 MHz (distributor listing) | — |
| Packhaging | 256-LBGA / 256-FBGA | — |
| Ball Pitch | 1 mm | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Configuration Memory | Flash (single-chip, non-volatile) | Nonvolatile flash |
| Analog Features | Integrated configurable analog blocks, clock generation and management | — |
| Temperature na Operasyon | [DATA_NEEDED: Operating Temperature Range] | 0°C to +70°C |
| Packaging | Tray | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS Status] | — |
| Level ng MSL | [DATA_NEEDED: Moisture Sensitivity Level] | — |
| Device Type | — | Fusion mixed-signal FPGA |
| Metal Layers | — | 7 layers |
| Power-Up Configuration | — | Live at Power-Up (LAPU) |
| System Performance Frequency | — | 350 MHz |
| Volte ng Pagbibigay | — | 1.5 V |
| Logic Family | — | CMOS |
| Total Pin Count | — | 256 pins |
| Package Type | — | BGA-256 |
| Package Pitch | — | 1.0 mm |
| Package Form | — | Square |
| Terminal Type | — | Ball |
| Temperature Grade | — | Industrial |
| Programmable Analog Resources | — | Configurable analog blocks |
| Embedded Flash | — | Large flash memory blocks |
| Clock Management | — | Comprehensive clock generation and management circuitry |
| Programming Interface | — | [DATA_NEEDED: programming interface] |
| I/O Standards | — | [DATA_NEEDED: supported I/O standards] |
| Maximum I/O Current | — | [DATA_NEEDED: maximum I/O current] |
| Junction Temperature | — | [DATA_NEEDED: junction temperature rating] |