MC56F8356MFV60 vs DSP56F801FA60E Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MC56F8356MFV60 sa pamamagitan ng NXP Semiconductors at DSP56F801FA60E sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
DSP56F801FA60E - 16-bit DSC, 60MHz, 16KB Flash, LQFP-48 | NXP
DSP56F801FA60E ✗ Tapus ng BuhayPagsanggunian na paghahambing
| Parametro | MC56F8356MFV60 | DSP56F801FA60E |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | DSP | DSP |
| Katayuan ng Lifecycle | NRND | Tapus ng Buhay |
| Core Architecture | 56800E (16-bit DSC, dual Harvard) | Harvard-style, CISC |
| Core Frequency | 60 MHz | — |
| Program Flash | 256 KB | — |
| Unified RAM | 4 KB | — |
| Data Flash | 8 KB | — |
| Volte ng Pagbibigay | 3.0 V to 3.6 V | 3.3 V |
| Temperature na Operasyon | -40C to +125C | — |
| Packhaging | 144-pin LQFP (LFQFP) | 48-LQFP (7x7 mm) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| ADC | 2 x 12-bit, up to 8 channels | — |
| FlexPWM | Yes (dual 6-output modules with fault inputs) | — |
| FlexCAN | Yes (1 module) | — |
| SCI/UART | 2 ports | — |
| SPI | 1 port | — |
| External Memory Interface | Yes | — |
| Level ng MSL | 3 (168 Hours) | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| HTSUS | 8542.31.0001 | — |
| Debug Interface | JTAG/Enhanced OnCE | — |
| Core | — | 56800 (16-bit DSC) |
| Maksimum na Taktiko ng Oras | — | 60 MHz |
| Program Memory Size | — | 16KB (8K x 16) Flash |
| Terminal Form | — | Gull Wing |
| Number of Terminals | — | 48 |
| Package Code | — | LFQFP, Square |
| Temperature Grade | — | Industrial |
| Product Family | — | 56F8xx Digital Signal Controllers |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |
| Hanay ng Temperature na Operasyon | — | [DATA_NEEDED: operating temperature range] |
| Thermal Resistance Theta-JA | — | Simulated per JEDEC JESD51-2 (natural convection) |
| Packaging | — | Tray |