MC9S08GB32CFU vs MC9S08GB32CFUE Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MC9S08GB32CFU sa pamamagitan ng NXP Semiconductors at MC9S08GB32CFUE sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MC9S08GB32CFU - 8-bit S08 MCU 32KB Flash 40MHz 64-LQFP | NXP
MC9S08GB32CFU ✓ NakahandaNXP Semiconductors
MC9S08GB32CFUE - S08 8-Bit MCU, 32KB Flash, 40MHz | NXP
MC9S08GB32CFUE ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | MC9S08GB32CFU | MC9S08GB32CFUE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Aktibo | Huling Pagbili |
| Core | HCS08 (8-bit CISC) | — |
| Program Memory | 32 KB Flash | — |
| RAM | 2 KB | — |
| Maximum CPU Frequency | 40 MHz | 40 MHz |
| Operating Voltage | 2.7 V to 5.5 V | — |
| ADC | 10-bit, 8 channels | — |
| USB | USB 2.0 Full-Speed Device | — |
| CAN | MSCAN (CAN 2.0A/B), 1 module | — |
| SCI/UART | 2 modules | — |
| SPI | 1 module | — |
| I2C | 1 module | — |
| Timers | TPM1, TPM2 (16-bit) | 16-bit timer/PWM module(s) |
| GPIO Pins | 56 | — |
| Packhaging | 64-LQFP (10x10 mm, 0.5 mm pitch) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | -40 C to +85 C (industrial) | — |
| Level ng MSL | 3 (per JEDEC J-STD-020) | Per JEDEC J-STD-020 (see datasheet) |
| Tindminan RoHS | Compliant (lead-free LFQFP) | Compliant |
| Core Architecture | — | HCS08 (S08 family) |
| Width ng Data Bus | — | 8-bit |
| Program Memory Size | — | 32 KB (32K x 8) Flash |
| RAM Size | — | 2 KB |
| Number of I/O Pins | — | 56 |
| Packhaging / Kaso | — | 64-LQFP (10x10 mm) |
| Supply Voltage Range | — | 2.7 V to 5.5 V (operational, typical 5 V) |
| Hanay ng Temperature na Operasyon | — | -40C to +85C (industrial) |
| On-chip ADC | — | Yes (resolution and channel count per datasheet) |
| Communication Interfaces | — | SCI (UART), SPI, I2C |
| Debug Interface | — | Background Debug Mode (BDM) |
| Lead-Free / Halogen-Free | — | Lead-free per manufacturer datasheet |