MC9S12DJ128MPVE vs MC9S12DJ256MPVE Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MC9S12DJ128MPVE sa pamamagitan ng NXP Semiconductors at MC9S12DJ256MPVE sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MC9S12DJ256MPVE - HCS12 16-Bit MCU 256KB Flash | NXP | Automotive
MC9S12DJ256MPVE NrndPagsanggunian na paghahambing
| Parametro | MC9S12DJ128MPVE | MC9S12DJ256MPVE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | NRND | NRND |
| Core Architecture | HCS12 (16-bit CISC) | HCS12 (16-bit CISC) |
| Program Memory (Flash) | 128 KB (128K x 8) | — |
| RAM | 8 KB | 12 KB |
| EEPROM | 2 KB | 4 KB |
| Maximum CPU Clock | 25 MHz (50 MHz internal bus via PLL, see datasheet) | — |
| Volte ng Pagbibigay | 2.35 V to 2.75 V (single 2.5V nominal) | 2.35 V to 2.75 V core; 5 V typical with on-chip regulator |
| Digital I/O Pins | 59 | — |
| ADC | 2x 8-channel, 10-bit | Two 8-channel, 10-bit |
| PWM Channels | 8 | 8-channel |
| SCI (UART) | 2 | — |
| SPI | 1 | — |
| I2C (Inter-IC Bus) | 1 | — |
| Packhaging | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm), gull-wing |
| Temperature na Operasyon | -40C to +125C (automotive grade) | -40C to +125C (automotive AEC-Q100 grade) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Level ng MSL | [DATA_NEEDED: MSL level per JEDEC J-STD-020] | — |
| Debug Interface | BDM (Background Debug Mode) | — |
| Tindminan RoHS | Compliant | Compliant (lead-free matte-tin finish) |
| CPU Bit Width | — | 16-bit |
| Maximum CPU Frequency | — | 25 MHz (some sources cite 50 MHz bus) |
| Program Flash | — | 256 KB (256K x 8) |
| I/O Pins | — | 59 (some package variants expose 91) |
| Enhanced Capture Timer | — | 8-channel IC/OC |
| SCI (UART) Modules | — | 2 asynchronous |
| CAN Module | — | 1 x CAN 2.0 (per family datasheet) |
| SPI Module | — | 1 synchronous serial (per family) |
| Moisture Sensitivity Level | — | MSL 3 (per JEDEC J-STD-020) |
| Background Debug Mode | — | Yes (BDM) |
| Katayuan ng Lifecycle | — | NRND (Not Recommended for New Designs) |