MC9S12DP512CPVE vs MC9S12DP512CPV Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng MC9S12DP512CPVE sa pamamagitan ng NXP Semiconductors at MC9S12DP512CPV sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

NXP Semiconductors
MC9S12DP512CPVE MC9S12DP512CPVE - 16-Bit 25MHz HCS12 MCU | NXP

MC9S12DP512CPVE - 16-Bit 25MHz HCS12 MCU | NXP

MC9S12DP512CPVE ✓ Nakahanda
NXP Semiconductors
MC9S12DP512CPV MC9S12DP512CPV - 16-Bit HCS12 MCU, 512KB Flash, 112-LQFP | NXP

MC9S12DP512CPV - 16-Bit HCS12 MCU, 512KB Flash, 112-LQFP | NXP

MC9S12DP512CPV ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro MC9S12DP512CPVE MC9S12DP512CPV
Brand NXP Semiconductors NXP Semiconductors
Kategorya Microcontrollers Microcontrollers
Katayuan ng Lifecycle Aktibo Aktibo
Product Type 16-bit HCS12 CISC microcontroller —
Maximum Operating Frequency 25 MHz —
Internal Flash Memory 512 KB —
Internal RAM 12 KB —
EEPROM 4 KB 4 KB
ADC Two 8-channel, 10-bit ADCs 2 x 8-channel, 10-bit
Serial Communication Interfaces 2 asynchronous serial communication interfaces —
Enhanced Capture Timer 8-channel IC/OC enhanced capture timer 8-channel 16-bit ECT
Pulse-Width Modulator 8-channel PWM —
General-Purpose I/O 91 pins —
Packhaging 112-pin LQFP (20x20) —
Core Architecture HCS12, CISC —
Operating Supply 2.5 V / 5 V —
Uri ng Pagpapasok Surface Mount Surface Mount
Series MC9S12 —
Uri ng Memory Flash —
Automotive Positioning MC9S12D family designed for automotive multiplexing applications —
Core — HCS12 (16-bit)
Bus Frequency — 25 MHz
Program Memory (Flash) — 512 KB (512K x 8)
RAM Size — 12 KB (12K x 8)
Number of I/O Lines — 91
Packhaging / Kaso — 112-LQFP (20 x 20 mm)
Volte ng Pagbibigay — 5.0 V (4.5 V to 5.5 V)
Temperature na Operasyon — -40 C to +85 C (industrial)
PWM Channels — 8
SCI (UART) — 2
SPI — 1
I2C — 1
CAN — 1 x CAN 2.0
Oscillator — Internal PLL with external crystal
Debug Interface — BDM (Background Debug Mode)
Process Technology — 0.25 um Flash
Tindminan RoHS — Compliant (lead-free)

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