MCF5270VM100 vs MCF5232CVM100 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng MCF5270VM100 sa pamamagitan ng NXP Semiconductors at MCF5232CVM100 sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

NXP Semiconductors
MCF5270VM100 MCF5270VM100 - ColdFire V2 100MHz MCU 196-LBGA | NXP

MCF5270VM100 - ColdFire V2 100MHz MCU 196-LBGA | NXP

MCF5270VM100 Nrnd
NXP Semiconductors
MCF5232CVM100 MCF5232CVM100 - ColdFire V2 MPU, 100MHz, 196-LBGA | NXP

MCF5232CVM100 - ColdFire V2 MPU, 100MHz, 196-LBGA | NXP

MCF5232CVM100 Nrnd

Pagsanggunian na paghahambing

Parametro MCF5270VM100 MCF5232CVM100
Brand NXP Semiconductors NXP Semiconductors
Kategorya Microcontrollers Microcontrollers
Katayuan ng Lifecycle NRND NRND
Core Processor ColdFire V2 (MCF527x) —
Core Size 32-Bit —
Speed 100 MHz —
Program Memory Type ROMless —
Program Memory Size [DATA_NEEDED: Program Memory Size] —
RAM Size 64K x 8 —
Number of I/O 61 —
Oscillator Type External —
Packhaging / Kaso 196-LBGA (15x15 mm MAPBGA) —
Uri ng Pagpapasok Surface Mount Surface Mount
Packaging Tray —
Supplier Device Package 196-MAPBGA —
Temperature na Operasyon [DATA_NEEDED: Operating Temperature] -40C to +85C (industrial)
Volte ng Pagbibigay [DATA_NEEDED: Supply Voltage] 1.5V core / 3.3V I/O (typical)
Peripherals [DATA_NEEDED: Peripherals] —
Connectivity [DATA_NEEDED: Connectivity interfaces] —
Katayuan ng Lifecycle NRND (Not Recommended for New Designs) NRND (Not Recommended for New Designs)
Core Architecture — ColdFire V2 (32-bit RISC)
Core Frequency — 100 MHz
Performance — 125 Dhrystone 2.1 MIPS
On-chip SRAM — 64 KB
On-chip Cache — 8 KB I-cache / 8 KB D-cache (configurable)
On-chip ROM — ROMless
Ethernet MAC — 10/100 Mbps (FEC)
Enhanced Timer (eTPU) — 16 channels
Encryption Accelerator — Hardware-accelerated (integrated)
DMA — 4-channel + external request/acknowledge
External Bus Interface — 32-bit (SRAM/ROM/Flash/DDR)
Packhaging — 196-LBGA (MAP-BGA) 15x15 mm
Tindminan RoHS — Compliant

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