MCIMX6G1CVM05AA vs MCIMX6G2CVK05AA-FR Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MCIMX6G1CVM05AA sa pamamagitan ng NXP Semiconductors at MCIMX6G2CVK05AA-FR sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MCIMX6G1CVM05AA - i.MX 6UltraLite ARM Cortex-A7 MPU, 528MHz | NXP
MCIMX6G1CVM05AA ✓ NakahandaNXP Semiconductors
MCIMX6G2CVK05AA-FR - i.MX6UL ARM Cortex-A7 MPU 528MHz | NXP
MCIMX6G2CVK05AA-FR ✓ NakahandaPagsanggunian na paghahambing
| Parametro | MCIMX6G1CVM05AA | MCIMX6G2CVK05AA-FR |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Manufacturer | NXP Semiconductors | — |
| Series | i.MX 6UltraLite | — |
| Core | ARM Cortex-A7 (single core) | — |
| Core Architecture | ARMv7-A | — |
| Maximum CPU Clock | 528 MHz | — |
| Nominal CPU Clock | 500 MHz | — |
| Bit Width | 32-bit | — |
| Package Type | 289-ball MAPBGA | — |
| Package Dimensions | 14 x 14 mm | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Graphics Accelerator | PxP 2D pixel processing pipeline | — |
| Ethernet | Dual 10/100 MAC | — |
| USB | Dual USB 2.0 with integrated PHY | 2 x USB 2.0 OTG with integrated PHY |
| CAN | Dual CAN-FD | 2 x CAN-FD |
| Hanay ng Temperature na Operasyon | -40C to +105C (industrial) | — |
| Tindminan RoHS | Compliant | — |
| CPU Core | — | ARM Cortex-A7 (single core, 32-bit) |
| Maximum CPU Frequency | — | 528 MHz |
| L1 Instruction Cache | — | 16 KB |
| L1 Data Cache | — | 16 KB |
| L2 Cache | — | 128 KB |
| Memory Interface | — | LPDDR2, DDR3, DDR3L (16-bit) |
| ADC | — | 2 x 12-bit SAR ADC (up to 10 input channels) |
| I/O Voltage Support | — | 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V |
| Security Features | — | Secure boot, high-assurance boot, tamper detection, OTF DRAM encryption |
| Packhaging | — | 272-MAPBGA (9x9 mm, 0.5 mm pitch) |
| Temperature na Operasyon | — | -40C to +105C (TJ) |
| Process Technology | — | 40 nm CMOS |
| Level ng MSL | — | 3 |
| Lead-Free / RoHS | — | Yes - Compliant |