MPC8343EVRAGDB vs MPC8343CVRAGDB Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPC8343EVRAGDB sa pamamagitan ng NXP Semiconductors at MPC8343CVRAGDB sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MPC8343EVRAGDB - PowerQUICC II Pro 400MHz Host Processor | NXP
MPC8343EVRAGDB ✗ Tapus ng BuhayNXP Semiconductors
MPC8343CVRAGDB - PowerQUICC II Pro 400MHz SoC | NXP
MPC8343CVRAGDB ✗ Tapus ng BuhayPagsanggunian na paghahambing
| Parametro | MPC8343EVRAGDB | MPC8343CVRAGDB |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Tapus ng Buhay | Tapus ng Buhay |
| Core Architecture | PowerPC e300 (32-bit) | Power Architecture (Book E enhancements) |
| Core Frequency | 400 MHz | — |
| Packhaging | 620-pin HCTE BGA (29x29 mm) | — |
| Temperature na Operasyon | 0C to 105C | — |
| Memory Controller | DDR1/DDR2 SDRAM with ECC | DDR1 / DDR2 |
| Ethernet | 2x 10/100/1000 Mbit MAC | Dual 10/100/1000 (GigE) |
| PCI Interface | PCI v2.3 | — |
| USB | USB 2.0 Full/Low Speed | Hi-Speed USB 2.0 |
| Security Engine | SEC (DES/3DES/AES/SHA-1/MD-5/RSA) | — |
| I/O Voltage | 1.8V / 2.5V / 3.3V | — |
| Process Technology | 0.13 um CMOS | — |
| Series | PowerQUICC II Pro (MPC83xx) | PowerQUICC II Pro |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant (Pb-free per NXP datasheet) | — |
| Tray Packaging | Tray (per FindIC datasheet listing) | — |
| Manufacturer | — | NXP Semiconductors |
| Part Family | — | MPC8343EA |
| Core Processor | — | PowerPC e300 |
| Number of Cores | — | 1 |
| Width ng Data Bus | — | 32-bit |
| Maksimum na Taktiko ng Oras | — | 400 MHz |
| Volte ng Pagbibigay | — | 1.2 V core / 1.8 V / 2.5 V / 3.3 V I/O |
| Hanay ng Temperature na Operasyon | — | -40 °C to +105 °C |
| Package Type | — | 620-HBGA (Hi-TCE, 29 mm × 29 mm, 1 mm pitch) |
| Lead-Free / RoHS | — | Yes / Compliant |
| PCI | — | Dual PCI (PCI 2.3) |
| Security Accelerator | — | DES / 3DES / AES / IPSec / SSL/TLS |
| Silicon Revision | — | Rev 2.1 |