MPC8347VVAJDB557 vs MPC8347VVAJDB Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPC8347VVAJDB557 sa pamamagitan ng NXP Semiconductors at MPC8347VVAJDB sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MPC8347VVAJDB557 - PowerQUICC II Pro 533MHz Host Processor | NXP
MPC8347VVAJDB557 ✓ NakahandaNXP Semiconductors
MPC8347VVAJDB - PowerQUICC II Pro MPU, 533MHz, 672-TBGA | NXP
MPC8347VVAJDB ✗ Tapus ng BuhayPagsanggunian na paghahambing
| Parametro | MPC8347VVAJDB557 | MPC8347VVAJDB |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Aktibo | Tapus ng Buhay |
| Manufacturer | NXP Semiconductors | NXP USA Inc. |
| Series | PowerQUICC II Pro | MPC8347E PowerQUICC II Pro |
| Core Architecture | PowerPC e300 | — |
| Core Count | 1 | — |
| Width ng Data Bus | 32-bit | — |
| Maximum Core Frequency | 533 MHz | — |
| Packhaging | 672-TBGA (35x35 mm) | — |
| Memory Controller | DDR1/DDR2 up to 333 MHz | DDR1 / DDR2 up to 333 MHz |
| Ethernet | 10/100/1000 (1 Gbit/s MAC) | 10/100/1000 (1 Gbps) |
| USB | USB 2.0 (Full/High-speed) | USB 2.0 Full-Speed |
| PCI | 32-bit PCI 2.3 | — |
| Security Engine | AES, 3DES, SHA-1/MD5 | Not present (non-E variant) |
| Temperature na Operasyon | 0C to +105C | 0C to +105C |
| Silicon Revision | Rev 2 | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Tindminan RoHS | Compliant | Compliant |
| MPN | — | MPC8347VVAJDB |
| Core Processor | — | PowerPC e300 |
| Number of Cores / Bus Width | — | 1 Core / 32-Bit |
| Core Speed | — | 533 MHz |
| Packhaging / Kaso | — | 672-TBGA (35x35 mm) |
| PCI Interface | — | 32-bit PCI 2.3 |
| Process Technology | — | 0.13 um CMOS |
| I/O Voltage | — | 1.8V / 2.5V / 3.3V (mixed) |
| Tray Quantity | — | Per TBGA tray specification |
| Lifecycle | — | End of Life (EOL) per NXP product page |