MPC859TCVR100A vs MPC852TZT80A Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPC859TCVR100A sa pamamagitan ng NXP Semiconductors at MPC852TZT80A sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MPC859TCVR100A - 100MHz PowerQUICC MPU, 357-PBGA | NXP
MPC859TCVR100A ✓ Nakahanda
Pagsanggunian na paghahambing
| Parametro | MPC859TCVR100A | MPC852TZT80A |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Architecture | 32-bit Power Architecture (PowerPC 8xx family) | — |
| Core | MPC8xx 1 Core, 32-Bit | MPC8xx (32-bit Power Architecture) |
| Core Frequency | 100 MHz | 80 MHz |
| Instruction Set | PowerPC | — |
| Memory Controller | 8/16/32-bit ROM/FLASH/SRAM/DRAM | — |
| Communications Processor Module | Yes (CPM with serial channels) | — |
| Local Bus | 32-bit PC-AT ISA-style (M68000 bus compatible) | — |
| PCMCIA Interface | Yes, 2 card slots supported | — |
| Timers | Four 16-bit timers | — |
| Interrupt Controller | Integrated in SIU | — |
| DMA | Integrated in CPM (peripheral DMA) | — |
| Temperature na Operasyon | -40C to +100C | 0 °C to +95 °C |
| Packhaging | 357-PBGA (25x25 mm) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | [DATA_NEEDED: lead-free/RoHS status] | Non-Compliant (legacy part) |
| Operating Voltage (Core) | [DATA_NEEDED: core VDD] | — |
| Operating Voltage (I/O) | [DATA_NEEDED: I/O VDD] | — |
| Process Technology | [DATA_NEEDED: process node] | 0.18 µm CMOS |
| Manufacturer | — | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series | — | PowerQUICC, MPC8xx |
| Core Count | — | 1 |
| Volte ng Pagbibigay | — | 3.3 V |
| Package Type | — | 256-PBGA (Plastic Ball Grid Array) |
| Package Dimensions | — | 23 x 23 mm |
| Tray Packaging | — | Tray (per distributor listing) |
| Product Category | — | Microprocessors (MPU) |
| Lead Finish | — | Contains lead (SnPb or lead-bearing solder profile) |